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Yyyyyy x. yyyyyy
0000 xxxxxx xxxx , xxxx , xxxxx 00000 xxx-xxx-xxxx ~ abc@xyz.com
Profile
Ø Results-driven applications manager/senior scientist with expertise in the semiconductor industry with all major technologies and 180nm-22nm modes.
Ø Excel in leading diverse teams, have spearheaded numerous training initiatives, equipping staff with tools and resources for maximizing performance.
Ø Co-author of 10 U.S. patents with additional applications pending.
Professional Experience
ATMI CORP, Danbury, CT; Tempe, AZ 2002-Present
Applications Manager (2006-Present)
Strategically develop new additive chemistries for Cu plating baths with 22 nm node and below by devising a new testing methodology for screening advanced additive systems.
Oversaw penetration of Cu slurry market in China, currently forecasted at $5 million in sales for 2011.
Facilitate screening of new additives by assisting customers.
Contribute dynamic analytical skills to enable rapid time to market for new post CMP cleans chemistry designed for 32 nm node and below; achieved first customer win in 2009.
Maximize customized and robust product performance through integration of design for Six Sigma and DOE tools.
Cultivate strong industry relationships with external CMP foundry to support applications testing initiatives.
Co-developed a novel CMP slurry blend system enabling high throughput and high purity blending.
Spearheaded design initiatives for Six Sigma methodologies and application testing on CMP production tools to ensure a robust system.
Senior Research Scientist (2002-2006)
Consistently met advanced node requirements through development of new Cu CMP slurries as well as Cu and barrier CMP slurries for multiple customers.
Directed external foundry team testing of ATMI Cu and barrier slurries for customer applications.
INFINEON CORPORATION, Fishkill, NY 2000-2002
BEOL Process Engineer-DRAM Alliance with IBM Corporation
Conceptualized, developed, and qualified W CMP to enable low K dielectric integration in DRAM design as well as Cu CMP compatible with dual damascene Cu for 180 nm -90 nm node.
Education
UNIVERSITY AT ALBANY-Albany, NY, Ph.D. in Physics
Studied surface reactions during Cu and Al CMP; partnered with Olin and Silbond Corporation to test Cu slurry development.
U.S. Patents
US0000 xxxxxx xxxx , xxxx , xxxxx 00000229461 Chemical mechanical polishing compositions for copper and associated materials and method of using same
US20050014454 Chemical mechanical polishing (CMP) process using fixed abrasive pads
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Yyyyyy x. yyyyyy Page Two
U.S. Patents (Continued)
US0000 xxxxxx xxxx , xxxx , xxxxx 00000248399 Integration scheme for metal gap fill, with fixed abrasive CMP
US20030153198 Carbon-graded layer for improved adhesion of low-k dielectrics to silicon substrates
US20080254628 High throughput chemical mechanical polishing composition for metal film planarization
US20090137122 Method of passivating chemical mechanical polishing compositions for copper film planarization processes
US20090215269 Integrated chemical mechanical polishing composition and process for single platen processing
US20030186551 Integration scheme for metal gap fill with HDP and fixed abrasive CMP
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